EPITS 2015 is the foremost opportunity for the demonstration of new advances and research results in the fields of Electronic Pakaging Interconnect Technology. This conferences brings together all leading academics, researchers, engineers and scientists around the world contributing to the global debate on Electronic Pakaging Technology. Topics of interest for submission include, but are not limited to:


(1) Challenges in implementing the Restriction of Hazardous Substances (ROHS).

(2) Emerging interconnect materials and technologies.

(3) Non-solder interconnect materials at chip and package levels.

(4) Fundamental materials behavior for electronic packaging materials.

(5) Electromigration, thermomigration, stress-migration and mechanical effects.

(6) Advanced characterization methods as applied to electronic packaging technology.

(7) Whisker growth in tin, tin-based alloys and other metallic systems related to electronic packaging materials.

(8) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics.