Keynote Speaker 1:

Prof. Albert Tzu-Chia Wu 


Department of Chemical and Materials Engineering,

National Central University, Taiwan.

Prof. Albert Tzu-Chia Wu received his B.S. degree from National Tsing Hua University (Hsinchu, Taiwan). He then received the degree of Master of Science from National Chiao Tung University (Hsinchu, Taiwan). Prof. Wu received his Ph.D. degree from the department of Materials Science and Engineering at University of California Los Angeles. Prof. Wu is currently a tenure track full professor at National Central University (Taoyuan, Taiwan). Prof. Wu serves as the organizing committee of TMS and MS&T in USA. He is currently the guest editor for Journal of Electronic Materials. Prof. Wu focuses on the research topics on tin whisker, electromigration and new Pb-free alloy development for advanced electronic packaging. He also investigates barrier materials to improve the reliability of thermoelectric modules. He adopted synchrotron radiation X-ray at National Synchrotron Radiation Research Center (NSRRC) and X-ray nanodiffraction at Taiwan Photon Source (TPS) to study microstructure evolution and stress distribution of the materials.

Lecture Title: Mechanism of spontaneous tin whisker growth


Keynote Speaker 2:

Dr. Christopher Gourlay


Department of Materials,

Imperial College, London

Chris Gourlay is a Reader at Imperial College London.  He read metallurgy at the University of Oxford (MEng, 2002) and the University of Queensland (PhD, 2007) and joined the Materials Department at Imperial College in 2008.  From 2014-19 he holds a UK government Research Fellowship for Growth in “solidification processing of alloys for sustainable manufacturing” in parallel with his faculty position.  His group investigates alloy solidification with a focus on mushy-zone mechanics, nucleation and the growth of dendrites, eutectics and intermetallics.  Recent activities on Pb-free soldering have included the formation of metastable NiSn4 in joints on Ni substrates, the growth of Cu6Sn5 and the development of heterogeneous nucleants for tin. He is an Associate Editor of the Journal of Crystal Growth.

Lecture Title: Solidification of BGA solder joints: controlling nucleation and growth



Keynote Speaker 3:

Image result for Mr. Keith Sweatman

Mr. Keith Sweatman

Senior Technical Advisor

Nihon Superior Co. Ltd., Japan

Keith Sweatman is a graduate in metallurgical engineering and began his involvement with soldering technology with the International Tin Research Institute, an organisation that did much of the work that established a scientific basis for what was previously the art of soldering.  He took that experience with him to Multicore Solders where he worked in a variety of technical and management roles that culminated in the position of managing director of Multicore Solders operations in the Asia Pacific Region.  Since 2001 he has been assisting Nihon Superior Co, Ltd. in the development of their global business in lead-free solders.  Over that period he has given some 60 presentations at conferences and seminars around the world and published articles in many of the industry journals.  

Lecture Title: Reliability without silver-stable properties at lower cost


Keynote Speaker 4: 

Dr Azman Jalar

Assoc. Professor, Universiti Kebangsaan Malaysia.

Dr. Azman Jalar is an associate professor of metallurgy and materials from the Faculty of Science and Technology, and senior research fellow at the Institute of Microengineering and Nanoelectronics,  Universiti Kebangsaan Malaysia. He received SmSn (BSc) in Materials Science from UKM and Ph.D degree in Metallurgy and Materials from the University of Birmingham, United Kingdom. He started his academic career as Tutor at UKM in 1995, then as Lecturer in 2001. He is the Head of Microelectronics Packaging and Materials (MIPAC) Research Group and the current Deputy Director of the Institute of Microengineering and Nanoelectronics (IMEN), UKM. His interest in microstructure-properties-performance motivates him to conduct research in electronic packaging. He also interested in electronic materials, nanomaterials, materialography and stereometry. He has significantly contributed to solving many industrial-related semiconductor packaging problems through industry-driven research activities. He has produced more than 200 publications in various referred journals and proceeding and hold few patents. He is a member of the Institution of Electrical and Electronics Engineer (IEEE), Malaysian Association of Solid State Science and Technology (MASS), Electron Microscopy Society of Malaysia (EMSM) Akademi Sains Islam Malaysia (ASASI) and the chairman of the Malaysian Electronics Packaging Research Society (EPRS).

Lecture Title: