1. Green materials and technology
  2. Emerging interconnect materials and technologies.
  3. Non-solder interconnect materials at chip and package levels.
  4. Fundamental materials behaviour for electronic packaging materials.
  5. Advanced characterization methods as applied to electronic packaging technology.
  6. Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics.
  7. Surface coating materials.
  8. Advanced materials.

>> “All accepted high quality papers will be published in Springer Book Series (Indexed by Scopus)”<<

Electronic Packaging Research Group
Center of Excellent Geopolymer and Green Technology, 
Universiti Malaysia Perlis (UniMAP)
 
Phone : 04-979 8154      Fax : 04-979 8178
Email : epits@unimap.edu.my
Websitewww.epits.unimap.edu.my
 
CONTACT PERSON
Dr. Dewi Suriyani Che Halin
dewisuriyani@unimap.edu.my
 
CO-ORGANIZER

DATE
13th to 14th September 2022

VENUE
Resort World Langkawi,
Malaysia.